Academic Journal
Quartile not availableIEEE Transactions on Components and Packaging Technologies
About IEEE Transactions on Components and Packaging Technologies
IEEE Transactions on Components and Packaging Technologies is a peer-reviewed scholarly journal published by Institute of Electrical and Electronics Engineers (US). It focuses on Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Heat Transfer and Optimization.
Key indicators: ISSN 15213331, 15579972; H-index 89; 1,507 works indexed; 42,093 citations.
Scope and Subject Areas
The journal covers: Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Heat Transfer and Optimization, Heat Transfer and Numerical Methods, Electrical Contact Performance and Analysis, Heat Transfer and Boiling Studies, Silicon Carbide Semiconductor Technologies, Integrated Circuits and Semiconductor Failure Analysis.
Journal Metrics
- H-index (89): 89 articles have each received at least 89 citations.
- Works indexed: 1,507 publications tracked in OpenAlex.
- Total citations: 42,093.
- Open Access: No.
Publishing in IEEE Transactions on Components and Packaging Technologies
Researchers should verify the journal's current scope, submission guidelines, and indexing status via the official journal website before submitting. Ensure your manuscript aligns with the journal's subject areas.
Official website: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144
Frequently Asked Questions
What is the ISSN of IEEE Transactions on Components and Packaging Technologies?
15213331, 15579972.
What subjects does IEEE Transactions on Components and Packaging Technologies cover?
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Heat Transfer and Optimization, Heat Transfer and Numerical Methods, Electrical Contact Performance and Analysis.
Who publishes IEEE Transactions on Components and Packaging Technologies?
Institute of Electrical and Electronics Engineers.
Is IEEE Transactions on Components and Packaging Technologies peer-reviewed?
Yes — it is a peer-reviewed scholarly journal.
Journal Metrics
A quartile may vary by subject category. Values without a source or reporting year are unverified historical entries. Verify the current Journal Impact Factor with Clarivate or the publisher before using it.
Aims & Scope
The publisher’s official aims and scope have not yet been verified for this profile. Use the journal website to check subject fit and accepted article types before submitting.
Recent Research Articles
Latest publications matched automatically by ISSN.
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
2010-12 · DOI: 10.1109/tcapt.2010.2102232Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation
Zong-Yuan Liu, Sheng Liu, Kai Wang, Xiao-Bing Luo et al.
2010-12 · DOI: 10.1109/tcapt.2010.2044576Our Thanks to Reviewers
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2010-12 · DOI: 10.1109/tcapt.2010.2070874Glowing Connection Experiments With Alternating Currents Below 1${\rm A}_{\rm rms}$
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2010-12 · DOI: 10.1109/tcapt.2010.2046488IEEE Transactions on Components and Packaging Technologies publication information
2010-12 · DOI: 10.1109/tcapt.2010.2102230Editorial - Science, Technology, and Industrial Policy
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2010-12 · DOI: 10.1109/tcapt.2010.2078350Analysis of Thermal and Luminous Performance of MR-16 LED Lighting Module
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2010-12 · DOI: 10.1109/tcapt.2010.2073469Table of contents
2010-12 · DOI: 10.1109/tcapt.2010.20977302011 IEEE membership form
2010-12 · DOI: 10.1109/tcapt.2010.2102234Influence of Die Attach Layer on Thermal Performance of High Power Light Emitting Diodes
Bohan Yan, Jiun Pyng You, Nguyen T. Tran, Yongzhi He et al.
2010-12 · DOI: 10.1109/tcapt.2009.2032097[Front cover]
2010-12 · DOI: 10.1109/tcapt.2010.2102235Enhanced Boiling Heat Transfer in Parallel Microchannels With Diffusion Brazed Wire Mesh
Hailei Wang, Richard B. Peterson
2010-12 · DOI: 10.1109/tcapt.2010.2070799Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode
Bongtae Han, Changsoo Jang, Avram Bar-Cohen, Bongmin Song et al.
2010-12 · DOI: 10.1109/tcapt.2010.2044413Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles
Masafumi Kuramot, Satoru Ogawa, Miki Niwa, Keun-Soo Kim et al.
2010-12 · DOI: 10.1109/tcapt.2010.2064313Process Development and Reliability of Microbumps
Sharon Pei-Siang Lim, Vempati Srinivasa Rao, Wai Yin Hnin, Wai Leong Ching et al.
2010-12 · DOI: 10.1109/tcapt.2010.2046487Electrical Contact Resistance in Thin $({\leq}{\rm 0.5}~\mu{\rm m})$ Gold Plated Contacts: Effect of Gold Plating Thickness
Prashant Misra, J. Nagaraju
2010-12 · DOI: 10.1109/tcapt.2010.2060340Direct Submount Cooling of High-Power LEDs
Dae-Whan Kim, Emil Rahim, Avram Bar-Cohen, Bongtae Han et al.
2010-12 · DOI: 10.1109/tcapt.2010.2040618Table of contents
2010-12 · DOI: 10.1109/tcapt.2010.2102233Reviews
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Version History
October 10, 2026 at 4:22 am
October 9, 2026