Academic Journal
Quartile not availableIEEE Transactions on Components Packaging and Manufacturing Technology
About IEEE Transactions on Components Packaging and Manufacturing Technology
About IEEE Transactions on Components Packaging and Manufacturing Technology
IEEE Transactions on Components Packaging and Manufacturing Technology is a peer-reviewed scholarly journal published by Institute of Electrical and Electronics Engineers.
Key indicators: ISSN 21563950, 21563985.
Understanding This Journal's Metrics
Journal metrics help researchers assess fit, but they must be interpreted in context:
Publishing in IEEE Transactions on Components Packaging and Manufacturing Technology
When considering this journal, verify its current indexing status, editorial board, and recent publications to ensure it meets your needs for visibility and credibility.
- Author guidelines: Follow formatting, reference style, and article-type requirements exactly — non-compliant manuscripts may be returned without review.
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- Audience match: Will the journal's readers cite and build on your findings?
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- Indexing: Confirm indexing in Web of Science, Scopus, and PubMed (if biomedical) meets your institutional requirements.
- Open access needs: Check funder mandates and whether the journal offers compliant OA options.
Frequently Asked Questions
What is the ISSN of IEEE Transactions on Components Packaging and Manufacturing Technology?
21563950, 21563985.
Who publishes IEEE Transactions on Components Packaging and Manufacturing Technology?
Institute of Electrical and Electronics Engineers.
Is IEEE Transactions on Components Packaging and Manufacturing Technology peer-reviewed?
Yes — it is a peer-reviewed scholarly journal indexed in major academic databases.
Journal Metrics
A quartile may vary by subject category. Values without a source or reporting year are unverified historical entries. Verify the current Journal Impact Factor with Clarivate or the publisher before using it.
Aims & Scope
The publisher’s official aims and scope have not yet been verified for this profile. Use the journal website to check subject fit and accepted article types before submitting.
Recent Research Articles
Latest publications matched automatically by ISSN.
A Comprehensive Design Framework for Vertical Power Delivery in High-Performance Computing
Sriharini Krishnakumar, Yaroslav Popryho, Mingeun Choi, Ramin Rahimzadeh Khorasani et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3724907Research on Low-Temperature Thermocompression Bonding of Glass Substrates Assisted by Nano Titanium Passivation Layer
Zihan Wang, Jihua Zhang, Zhen Fang, Jinxu Liu et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3724823Experimental Optimization of Liquid--Vapor Phase Separation in High Heat Flux Capillary-Driven μ -Coolers
Kaiying Jiang, Heungdong Kwon, Mehdi Asheghi, Kenneth Goodson et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3697351Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation
Sanghyeon Chang, Paul Paret, Sreekant Narumanchi, Yoonjin Won et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3656473Physics-Guided FE Surrogate CDNN With Grouped Attention and Monotonicity Constraints for Solder Joint Thermal Fatigue Life Prediction
Yaxian Huang, Yang Xi, Renxiang Wang, Wenwang Zhang et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3721074IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors
2026-09 · DOI: 10.1109/tcpmt.2026.3728931The Effect of Particle Pollution on the Temperature Rise of Assembled Printed Circuit Boards
Shengjie Liu, Hansheng Zhang, Fan Zhang, Yin Luo et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3666180The Dynamic Capillary Limits of a Heat Pipe: Mapping the Operating Power Ranges Using a Transient Dryout and Rewetting Model
Shrutika Singh, Justin A. Weibel
2026-09 · DOI: 10.1109/tcpmt.2026.3689442Self-Aligned Low-Temperature Cu--Cu Direct Bonding in Air
Kexuan Zhang, Fangcheng Cao, Xingyan Zhao, Yang Qiu et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3720603Investigation of the Interface Reliability of Multilevel Stacked Copper Microvias: Modeling and Simulation
Syed Mujahid Abbas, Qiang Yu, Michael Pecht
2026-09 · DOI: 10.1109/tcpmt.2026.3704315Compact IPD Bandpass Filter With Wide Upper Stopband in GaAs Technology
Gang Zhang, Yuanming Yan, Yichuan Jiang, Zehua Liu et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3716634Predictive Modeling of TCV-Cu Protrusion Under Thermal Cycling
Heran Zhao, Tao He, Dan Li, Lihua Cao et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3654515IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information
2026-09 · DOI: 10.1109/tcpmt.2026.3728929A Lossy Decoupling Network for Anti-Resonance Suppression and Capacitor Reduction in CoWoP
Yuying Li, Mu-Shui Zhang, Zi-Xin Wang
2026-09 · DOI: 10.1109/tcpmt.2026.3702815Self-Packaged All-Port CM Reflectionless Balanced Filtering Power Divider Based on SISPSL Structure With Broadband CM Absorption
Du Chen, Han-Peng Zheng, Xu Jiang, Feng Wei et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3685442Cross-Alloy Transfer Learning With Transferability Assessment for Mechanical Property Prediction of Lead-Free Solders
Qais Qasaimeh, Waad Tarman, Daniel F. Silva, Saad Hamasha et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3716524Ultracompact 2.5-D Integration of RF Interfaces and Opto-Electronic Devices via Silicon Interposer
Yueqi Zhao, Jinsheng Xu, Jia Li, Qian Zhang et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3698859Advancement in Hermetic Packaging for MEMS: An Al–Si–Ge Ternary Eutectic Bonding Approach With Interring Groove Structure
Bangda Xue, Wenhua Shi, Wenkui Lin, Weiming Lv et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3723173Equivalent Circuit Modeling of RF Degradation in TSVs for Millimeter-Wave Applications
Yong Wang, Minglong Wu, Kun He, Yue Tang et al.
2026-09 · DOI: 10.1109/tcpmt.2026.3717167Advanced Photonic Debonding Using Solution-Processed Ag Nanoparticle/Cu-Precursor Hybrid Light-Absorbing Layers for Wafer-Level Packaging
Soomin Song
2026-09 · DOI: 10.1109/tcpmt.2026.3718409Reviews
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Version History
October 10, 2026 at 7:06 pm
October 9, 2026