IEEE Transactions on Industrial Electronics

Journal Overview

IEEE Transactions on Industrial Electronics (TIE) is the flagship research transactions journal of the IEEE Industrial Electronics Society (IES), one of the oldest and largest technical societies of the Institute of Electrical and Electronics Engineers (source: ieee-ies.org/pubs, accessed Oct 2026). Published monthly, TIE is a peer-reviewed archival journal dedicated to applications of electronics, controls, instrumentation, and computation that improve industrial and manufacturing systems and processes (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/, accessed Oct 2026).

What distinguishes TIE from many other engineering journals is its insistence on real-world grounding: every paper must include experimental verification of its novel theoretical claims, demonstrated on an experimental rig containing genuine hardware components — not just a PC or laptop (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/initial-submission, accessed Oct 2026). Papers without experimental results are subject to immediate rejection. This application-oriented character has made TIE one of the most cited journals in electrical engineering and industrial electronics, consistently ranked in the top quartile (Q1) of its categories.

TIE is published by IEEE on behalf of the IEEE Industrial Electronics Society and is distributed worldwide through IEEE Xplore, the society's publication program, and institutional library subscriptions (source: ieee-ies.org/pubs, accessed Oct 2026). The journal's print ISSN is 0278-0046 and its electronic ISSN is 1557-9948 (source: IEEE official title list, open.ieee.org, accessed Oct 2026). It is indexed in the Science Citation Index Expanded (SCIE) of the Web of Science (source: open.ieee.org title list, accessed Oct 2026).

The journal operates a hybrid open-access model: it is primarily a subscription journal, but authors may choose to make individual articles freely available by paying an article processing charge (source: open.ieee.org title list — "Hybrid Open Access", accessed Oct 2026). The journal is led not by a single editor-in-chief but by several co-editors-in-chief, each responsible for a defined technical portfolio such as machines and drives, control and signal processing, or instrumentation and sensors (source: iten.ieee-ies.org, accessed Oct 2026).

History

IEEE Transactions on Industrial Electronics is the long-running archival research journal of the IEEE Industrial Electronics Society, published continuously as a monthly periodical. The Industrial Electronics Society itself is one of IEEE's longstanding technical societies, and TIE serves as its principal venue for peer-reviewed research on electronics applied to industrial problems (source: ieee-ies.org/pubs, accessed Oct 2026).

The journal's editorial lineage is documented by the society, which maintains a public roster of past editors-in-chief and past co-editors-in-chief (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/, accessed Oct 2026). Over the years the journal has evolved from a conventional single-editor model to a team of co-editors-in-chief, each overseeing a technical area — a structure that reflects both the growth of the field and the volume of submissions the journal receives. The IES publications page notes that the society alone receives over 15,000 conference and journal papers per year, underscoring why TIE's editorial model has had to scale (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).

TIE previously published special sections devoted to emerging topics; the society states that the journal currently does not publish special sections anymore, although a archive of previously published special sections is maintained (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/, accessed Oct 2026). The journal's publication rhythm has at times exceeded a single monthly issue: in 2024, several months (July through November) were split into "Part 1" and "Part 2" issues, reflecting the volume of accepted papers (source: ieee-ies.org TIE issues listing, accessed Oct 2026).

In June 2025, during the IES Administrative Committee (AdCom) meeting in Toronto, IES President Milos Manic appointed new co-editors-in-chief for TIE for three-year terms running 2026–2028 (source: iten.ieee-ies.org, 21 July 2025, accessed Oct 2026). A year later, at the AdCom meeting of 27 June 2026 in Nagoya, Japan, IES President Juan José Rodríguez Andina appointed further co-editors-in-chief for TIE (source: iten.ieee-ies.org, accessed Oct 2026). These regular, term-based appointments — advised by the IES Publication Committee and validated by the AdCom — are how the society renews the journal's leadership (source: iten.ieee-ies.org, accessed Oct 2026).

Leadership and Editorial Team

TIE is led by multiple co-editors-in-chief (co-EiCs) serving three-year terms, each with responsibility for a technical portfolio. The following leadership facts are drawn from official IES announcements in IEEE Industrial Electronic Technology News (ITeN) (source: iten.ieee-ies.org, accessed Oct 2026).

Current co-editors-in-chief

• Prof. Giampaolo Buticchi — Co-Editor-in-Chief of TIE, portfolio Machines and Drives, term 2026–2028. He is Head of the Power Electronics, Machine and Control Research Centre at the University of Nottingham Ningbo China; his research focuses on power electronics for renewable energy systems, smart-transformer-fed micro-grids, and DC grids for transportation (source: iten.ieee-ies.org, 21 July 2025, accessed Oct 2026).
• Prof. Alejandro Gómez Yepes — Co-Editor-in-Chief of TIE, portfolio Control and Signal Processing, term 2026–2028. He is Profesor Titular at Universidade de Vigo, Spain, with the Applied Power Electronics Technology Research (APET) Group; his research centers on control of voltage-source converters and machine drives, with current emphasis on fault-tolerant multiphase drives (source: iten.ieee-ies.org, 21 July 2025, accessed Oct 2026).
• Prof. Roberto Oboe — Co-Editor-in-Chief of TIE, portfolio Instrumentation and Sensors, term 2026–2028 (second term). He is Full Professor of Automatic Control at the University of Padova, Italy; his interests include motion control, MEMS devices, applied digital control, telerobotics, and haptic devices. He is a Fellow of IEEE and previously served as VP for Technical Activities of IES (source: iten.ieee-ies.org, 21 July 2025, accessed Oct 2026).
• Prof. Sergio Vazquez — Co-Editor-in-Chief of TIE, term 2025–2027 (Fellow, IEEE). He is Full Professor in the Department of Electronics Engineering at the University of Seville, Spain; his research interests include power electronics systems, modeling, modulation, and control of power electronics converters applied to renewable energy technologies. He was a corecipient of the 2012 TIE Best Paper Award (source: iten.ieee-ies.org, 5 May 2025, accessed Oct 2026).
• Prof. Changyun Wen — Co-Editor-in-Chief of TIE, serving a second three-year term 2024–2026 (Fellow, IEEE). He is Full Professor at Nanyang Technological University, Singapore, working in control systems and applications, cyber-physical systems, smart grids, and complex systems and networks; he was listed as a Clarivate Highly Cited Researcher in 2020–2022 (source: iten.ieee-ies.org, accessed Oct 2026).

In addition, the IES AdCom meeting of 27 June 2026 in Nagoya resulted in the appointment of further co-editors-in-chief for TIE (source: iten.ieee-ies.org, accessed Oct 2026). The exact names announced at Nagoya were not fully detailed in the publicly accessible announcement excerpts consulted for this profile.

Associate editors and advisory board

Beneath the co-editors-in-chief, TIE is supported by a large board of associate editors — the complete list is published by the society and was last updated in January 2026 (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/, accessed Oct 2026). An international advisory board of senior figures guides the journal, including Carlo Cecati (Univ. of L'Aquila, Italy), Mo-Yuen Chow (NC State Univ., USA), Leopoldo G. Franquelo (Univ. of Seville, Spain), Marian P. Kazmierkowski (Warsaw Univ. of Technology, Poland), Fumio Harashima (Tokyo Metropolitan Univ., Japan), Joachim Holtz (Wuppertal Univ., Germany), J. David Irwin (Auburn Univ., USA), and Bogdan M. Wilamowski (Auburn Univ., USA) (source: ieee-ies.org, accessed Oct 2026). Journal administrators handle the day-to-day manuscript workflow through the ScholarOne system.

Appointment process

Co-editors-in-chief are appointed by the IES President on the advice of the society's Publication Committee, with the appointments validated by the IES Administrative Committee at its meetings (for example, Toronto in June 2025 and Nagoya in June 2026) (source: iten.ieee-ies.org, accessed Oct 2026). Terms are three years, and reappointment for a second term is possible, as the appointments of Roberto Oboe and Changyun Wen demonstrate.

Aims & Scope

The journal describes its mission as publishing papers whose applications of electronics, controls, instrumentation, and computation are experimentally verified and directed at improving industrial systems and processes (source: ieee-ies.org, accessed Oct 2026). In practical terms, this means TIE is an engineering applications journal first and a theory journal second: a manuscript's novel concepts must be proven on real hardware, not merely simulated.

The topical coverage officially listed by the society includes: power electronics and electric motor drives; system control; signal processing; fault detection and diagnosis; power electronics for renewable energy and power systems; instrumentation; measurement and testing; modeling and simulation; motion control; mechatronics and robotics applications; sensors and actuators; and the use of artificial intelligence in industrial electronic systems (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/, accessed Oct 2026).

The society further organizes the journal's remit into ten technical areas: multi-phase systems; machines and drives; single-phase electronics; renewable energy systems; robotics and mechatronics; actuators and motors; control and signal processing; diagnosis and monitoring; instrumentation and sensors; and embedded systems (source: ieee-ies.org, accessed Oct 2026). Each area is aligned with the co-editors-in-chief's portfolios, so a submission on, say, multiphase drives falls under the machines-and-drives portfolio, while a paper on industrial sensors falls under instrumentation and sensors.

Equally important is what the journal does not publish. TIE's editorial policy explicitly declines surveys, state-of-the-art review papers, and project reports — only guest editors of special sections (or submissions expressly allowed by the editorial board) may submit such manuscripts. Typical TIE papers propose new methods and demonstrate their effectiveness through experimental results combined with simulation results (source: ieee-ies.org initial-submission checklist, accessed Oct 2026). A separate out-of-scope topics list is maintained by the society to help authors self-screen before submitting.

Editorial Process and Peer Review

Manuscripts are submitted electronically through IEEE's ScholarOne Manuscripts system (formerly Manuscript Central) at the TIE-specific portal (source: ieee-ies.org initial-submission, accessed Oct 2026). The review workflow follows the standard IEEE transactions path, which authors can track inside their ScholarOne Author Center: In EiC office → Assigned to AE → AE invites reviewers → AE assigns reviewers → Under review → Awaiting AE decision → Awaiting EiC decision (source: ieee-ies.org initial-submission, accessed Oct 2026). The society advises authors whose manuscripts have not moved for a month or more to contact the Editor-in-Chief.

TIE uses a single-blind peer-review process: authors are asked to remain fully identifiable within the manuscript, including their names, biographies, and affiliations (source: ieee-ies.org initial-submission checklist, accessed Oct 2026). As with all IEEE publications, review is governed by the IEEE Publication Services and Products Board Operations Manual, and accepted articles are screened for plagiarism.

Before a paper ever reaches reviewers, it must pass the journal's published submission checklist, which functions as a desk-screening gate. The checklist requires, among other things: mandatory experimental verification on a rig containing hardware beyond a PC or laptop (hardware-in-the-loop setups such as PLECS RT-Boxes, Typhoon kits, and OPAL-RT systems do qualify); an institutional primary e-mail address for every author (papers failing this are not put into the review process); a manuscript within the journal's scope; properly written abstract and title; a significant portion of references to recently published papers; and IEEE double-column formatting so that length and figure readability can be assessed (source: ieee-ies.org initial-submission, accessed Oct 2026).

Multiple-part papers are subject to immediate rejection unless the authors obtain the Editor-in-Chief's consent before submission (source: ieee-ies.org initial-submission checklist, accessed Oct 2026). If a significant portion of the manuscript was previously published at a conference, authors must use the journal's dedicated Post Conference Papers template and must cite the earlier work in the references (source: ieee-ies.org initial-submission checklist, accessed Oct 2026). ORCID identifiers are required for all authors (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/, accessed Oct 2026).

The journal does not publish an official acceptance rate or official average review timelines on its author pages; such figures, where they appear on third-party sites, are not endorsed by the journal and should not be treated as official (source: ieee-ies.org author pages, accessed Oct 2026 — no acceptance-rate or review-time figures published).

Impact and Metrics

The table below contains only figures published by official or authoritative sources. Where an official source does not publish a figure, that is stated explicitly.

A note on interpretation: the June 2026 JCR release assigned 2025 impact factors across the IES portfolio; ITeN, the society's official news channel, announced that the 2025 JIFs had been released and listed TIE among the society's journals covered, but the full per-journal table was not retrievable from the accessible excerpts. The figure of 7.4 above is the value reported by independent journal-metric trackers for the 2025 JIF (JCR June 2026 release) and is consistent with the society's announcement; treat it as the tracker-reported figure rather than a number quoted verbatim from an IES page (sources: iten.ieee-ies.org tag/journal-impact-factor, bioxbio.com, journalsearches.com — all accessed Oct 2026).

Submission Guidelines

The following requirements are taken from the journal's official initial-submission checklist and policies pages (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/initial-submission and /policies, accessed Oct 2026):

• Where to submit: electronically via ScholarOne Manuscripts, the TIE portal (mc.manuscriptcentral.com/tie-ieee). Create an account, go to the Author Center, and select "Submit First Draft of a New Manuscript"; all steps must be completed and a confirmation received (source: ieee-ies.org initial-submission, accessed Oct 2026).
• Experimental verification is mandatory: all submissions must contain experimental verification of the novel theoretical concepts on an experimental rig with hardware components other than a PC/laptop. Hardware-in-the-loop rigs (e.g., PLECS RT-Box, Typhoon HIL, OPAL-RT) qualify. Papers without experimental results face immediate rejection (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).
• Page limits: new "Regular paper" manuscripts may not exceed 10 pages including authors' biographies and photos; "Letters to the Editor" may not exceed 4 pages (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).
• Institutional e-mail: the primary e-mail address of every author must be an institutional address; this has applied to all authors of each new and revised paper since 1 April 2021 (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).
• No surveys or project reports: surveys, state-of-the-art papers, and project reports are not considered, except from guest editors of special sections or by editorial-board permission (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).
• No multi-part papers without consent: multiple-part papers are subject to immediate rejection unless the authors obtain the EiC's consent before submission (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).
• Formatting: manuscripts must be in IEEE double-column format using the journal's templates (Article template updated March 2024; Post Conference template updated April 2021, in PDF/Word/LaTeX). Upload only the manuscript file, in PDF (Word accepted if properly converted); embed non-standard fonts; maximum file size 40 MB; EPS figures required at the final stage (source: ieee-ies.org, accessed Oct 2026).
• References: all cited papers must be referenced within the text; the manuscript must be up to date, with a significant portion of references to recently published papers (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).
• Prior conference publication: if a significant portion was previously published at a conference, use the Post Conference Papers template and cite the previous work (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).
• ORCID: ORCID identifiers are required for all authors (source: ieee-ies.org/pubs/transactions-on-industrial-electronics/, accessed Oct 2026).
• Scope fit: the manuscript must be within the scope of IEEE Transactions on Industrial Electronics; the society maintains an out-of-scope topics list, and out-of-scope manuscripts cannot be adequately reviewed (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).

Open Access and APC

IEEE Transactions on Industrial Electronics is a hybrid open-access journal: published primarily on the subscription model, with an optional open-access route for individual articles (source: IEEE official title list, open.ieee.org — "Hybrid Open Access", accessed Oct 2026).

For hybrid IEEE journals, the official 2026 article processing charge published by IEEE is US $2,800 per article, based on the article's submission date; local taxes are added where applicable, and some journals charge additional fees such as overlength and color page charges (source: open.ieee.org/for-authors/article-processing-charges/, accessed Oct 2026). APCs may be paid by the author, the author's institution, or a funding agency (source: open.ieee.org, accessed Oct 2026). Authors should confirm the current figure in the journal's individual author instructions, since IEEE notes that exceptions apply for certain titles.

The journal's author pages accessed for this profile do not publish a specific overlength page-charge figure for TIE; IEEE's pricing page notes that some journals add overlength charges on top of the APC, so authors should check the current author instructions before submission (source: open.ieee.org, accessed Oct 2026). IEEE also offers APC discounts and waivers in defined cases — for example, corresponding authors from low-income countries may be eligible for reduced or waived APCs, and IEEE/society members receive discounts on some titles — but the exact discount schedule applicable to TIE is not published on the journal's own pages (source: open.ieee.org; ieee-aess.org APC page, accessed Oct 2026).

Key Facts

Frequently Asked Questions

1. What does "TIE" stand for?

TIE is the standard abbreviation for IEEE Transactions on Industrial Electronics, the flagship research journal of the IEEE Industrial Electronics Society (source: ieee-ies.org, accessed Oct 2026).

2. Who publishes IEEE Transactions on Industrial Electronics?

It is published by IEEE on behalf of the IEEE Industrial Electronics Society (IES) and distributed through IEEE Xplore and the society's publication program (source: ieee-ies.org/pubs, accessed Oct 2026).

3. Is TIE peer-reviewed, and what review model does it use?

Yes. TIE is a peer-reviewed archival journal using single-blind review: reviewers know the authors' identities, and the journal asks that all authors remain identifiable in the manuscript, including names, biographies, and affiliations (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).

4. What is the current impact factor of TIE?

The June 2026 Journal Citation Reports release assigned 2025 impact factors to the IES publications; independent JCR trackers report TIE's 2025 Journal Impact Factor as 7.4. The IEEE official title list (November 2023) records a 2022 JIF of 7.7, a 5-year JIF of 8.6, and Q1 status (sources: iten.ieee-ies.org; open.ieee.org, accessed Oct 2026).

5. Does TIE require experimental results?

Yes — this is one of the journal's defining rules. Every submission must include experimental verification of its novel concepts on a rig containing hardware components beyond a PC or laptop. Hardware-in-the-loop setups (e.g., PLECS RT-Box, Typhoon HIL, OPAL-RT) qualify. Papers without experimental results are subject to immediate rejection (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).

6. Does TIE publish review or survey papers?

As a rule, no. TIE's policy states it does not consider surveys, state-of-the-art papers, or project reports; only guest editors of special sections (or submissions expressly allowed by the editorial board) may submit them. The journal currently does not run special sections at all (source: ieee-ies.org, accessed Oct 2026).

7. What are the page limits for TIE submissions?

New regular-paper manuscripts may not exceed 10 pages including authors' biographies and photos; Letters to the Editor may not exceed 4 pages (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).

8. How do I submit a paper to TIE?

Manuscripts are submitted electronically through ScholarOne Manuscripts at the journal's portal (mc.manuscriptcentral.com/tie-ieee). Authors create an account, open the Author Center, choose "Submit First Draft of a New Manuscript," complete every step, and wait for e-mail confirmation (source: ieee-ies.org initial-submission, accessed Oct 2026).

9. Is TIE open access, and what is the APC?

TIE is a hybrid journal. Authors may publish open access by paying IEEE's 2026 hybrid-journal article processing charge of US $2,800 per article (plus applicable taxes), per IEEE's official APC schedule; authors should confirm the current figure in the journal's author instructions (source: open.ieee.org, accessed Oct 2026).

10. What is the acceptance rate of TIE?

The journal does not publish an official acceptance rate on its author pages. Figures quoted on third-party websites are not official and should be treated with caution (source: ieee-ies.org author pages, accessed Oct 2026).

11. Who leads the journal?

TIE is led by co-editors-in-chief serving three-year terms, each responsible for a technical portfolio. As of 2026 these include Giampaolo Buticchi (Machines and Drives), Alejandro Gómez Yepes (Control and Signal Processing), Roberto Oboe (Instrumentation and Sensors), Sergio Vazquez, and Changyun Wen; further co-editors-in-chief were appointed at the June 2026 IES AdCom meeting in Nagoya (source: iten.ieee-ies.org, accessed Oct 2026).

12. What topics does TIE cover?

Power electronics and motor drives, system control, signal processing, fault detection and diagnosis, renewable-energy power electronics, instrumentation, measurement and testing, modeling and simulation, motion control, mechatronics and robotics, sensors and actuators, and AI in industrial electronic systems — organized into ten technical areas (source: ieee-ies.org, accessed Oct 2026).

13. Do I need an institutional e-mail address to submit?

Yes. Since 1 April 2021, the primary e-mail address of every author on a new or revised paper must be an institutional address; papers that do not satisfy this are not put into the review process (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).

14. Can I submit a paper that was previously published at a conference?

Yes, but you must use the journal's dedicated Post Conference Papers template and must cite the previous conference work in the references, clearly indicating how the journal manuscript differs (source: ieee-ies.org initial-submission checklist, accessed Oct 2026).

Sources

• IEEE Industrial Electronics Society — TIE journal page (scope, editorial board, policies, issues): https://www.ieee-ies.org/pubs/transactions-on-industrial-electronics/ — accessed Oct 2026
• IEEE IES — TIE initial submission & checklist: https://www.ieee-ies.org/pubs/transactions-on-industrial-electronics/initial-submission — accessed Oct 2026
• IEEE IES publications overview: https://www.ieee-ies.org/pubs — accessed Oct 2026
• ITeN — Sergio Vazquez appointed co-EiC of TIE (2025–2027): https://iten.ieee-ies.org/announcement/2025/sergio-vazquez-new-co-editor-in-chief-of-tie/ — accessed Oct 2026
• ITeN — 2 Editors-in-Chief and 4 co-Editors-in-Chief for IES Publications Announced (Toronto AdCom, June 2025; Buticchi, Gómez Yepes, Oboe for TIE 2026–2028): https://iten.ieee-ies.org/announcement/2025/2026-eic-and-co-eic-for-ies-publications-announced/ — accessed Oct 2026
• ITeN — Co-EiCs for TIE/TII announced at Nagoya AdCom, 27 June 2026: https://iten.ieee-ies.org/announcement/ (announcement listing) — accessed Oct 2026
• ITeN — IES Publications Achieve Strong 2025 Journal Impact Factors (June 2026 JCR): https://iten.ieee-ies.org/tag/journal-impact-factor/ — accessed Oct 2026
• IEEE official title list (ISSN/eISSN, hybrid OA, SCIE, 2022 JIF 7.7, 5-year 8.6, Q1): https://open.ieee.org/wp-content/uploads/IEEE-Title-List-November-2023.pdf — accessed Oct 2026
• IEEE official 2026 article processing charges (hybrid journals US $2,800): https://open.ieee.org/for-authors/article-processing-charges/ — accessed Oct 2026