Academic Journal
Q2Journal of Electronic Packaging
About Journal of Electronic Packaging
Journal of Electronic Packaging is a scholarly journal published by American Society of Mechanical Engineers (ASME). SCImago 2025 lists it in Q2, with an SJR of 0.497 and H-index of 68.
Coverage: 1989-2026. Research categories: Computer Science Applications (Q2); Electrical and Electronic Engineering (Q2); Electronic, Optical and Magnetic Materials (Q2); Mechanics of Materials (Q2).
Source-backed journal facts
Topics in published research
Electronic Packaging and Soldering Technologies; Heat Transfer and Optimization; 3D IC and TSV technologies; Heat Transfer and Boiling Studies; Heat Transfer Mechanisms; Adhesion, Friction, and Surface Interactions.
OpenAlex classifies topics from published works. These topics are not the publisher’s official aims and scope.
Source: OpenAlex source record. Retrieved 2026-10-03. Source record updated 2026-10-02. OpenAlex metrics are different from SCImago metrics and the Clarivate Journal Impact Factor.
Journal Metrics
Quartile, SJR and the listed SCImago H-index use the 2025 imported SCImago dataset. A quartile may vary by subject category. Values without a source or reporting year are unverified historical entries. Verify the current Journal Impact Factor with Clarivate or the publisher before using it.
Aims & Scope
The publisher’s official aims and scope have not yet been verified for this profile. Use the journal website to check subject fit and accepted article types before submitting.
Recent Research Articles
Latest publications matched automatically by ISSN.
Package-Oriented Multiphysics Design of an Axial-Flux Integrated Drive Module for In-Wheel Applications
Hyeon-Jun Kim, Soo-Whang Baek
2026-12-01 · DOI: 10.1115/1.4072719Machine Learning Models of Heatsink Performance in Single-Phase Immersion Cooling: Application to Design Acceleration
Braxton J. Smith, Sai Abhideep Pundla, Dereje Agonafer
2026-12-01 · DOI: 10.1115/1.4072565Solid-Body Rotation and Implication of Secondary Flow Downstream the Obstruction and Partial Shroud of a Rotating Flow in an Enclosed Corotating System
Ibrahim Abubakar Masud, Ren Nakamoto, Tomohiro Ueno, Katsuaki Shirai et al.
2026-12-01 · DOI: 10.1115/1.4072590Experimental Evaluation of Cooling Loop Configurations for Server-Level Direct-to-Chip Liquid Cooling Systems
Ali Heydari, Abdallah Soud, Mohammad Tradat, Qusai Soud et al.
2026-12-01 · DOI: 10.1115/1.4072567Ultrahigh-Precision Two-Dimensional Indoor Positioning Using Inertial Information Only
Jumpei Ogawa, Kei Masunishi, Etsuji Ogawa, Daiki Ono et al.
2026-12-01 · DOI: 10.1115/1.4072566Validation of High-Density Fan-Out Interposer Through Test Vehicles
Cheng Yang, Haijie Chen, Corin Ke, Jincheng Zhang et al.
2026-12-01 · DOI: 10.1115/1.4072568A Novel Vision-Based Framework for Detecting Changes in Heat Flux in Pool Boiling Using Morphological Similarity
Pranay Nirapure, Ayushman Singh, Srikanth Rangarajan, Bahgat G. Sammakia et al.
2026-12-01 · DOI: 10.1115/1.4072308Integrating Liquid-to-Air Sidecars in High-Power Data Centers: Challenges and Best Practices
Vahideh Radmard, Farzaneh Hosseini, Ali Heydari, Mohammad Tradat et al.
2026-12-01 · DOI: 10.1115/1.4072185Analysis of Multifinger GaN HEMTs Using Gate Resistance Thermometry, Raman Thermometry, and Infrared Thermal Microscopy
Seokjun Kim, Daniel C. Shoemaker, Husam Walwil, Isaac Wildeson et al.
2026-12-01 · DOI: 10.1115/1.4072184Using Data Center Waste Heat for Hydrogen Production
Sam Kane, Maria Norman, Aaron P. Wemhoff
2026-12-01 · DOI: 10.1115/1.4071982Multiphysics-Constrained Optimization of an Axial-Flux Consequent-Pole Motor for Electronics Cooling Systems
Hyeon-Jun Kim, Wan-Chin Kim, Sangwook Lee, Soo-Whang Baek et al.
2026-12-01 · DOI: 10.1115/1.4071962Application of Laser Assisted Soldering for Replacing Massive Reflow in Solder Ball Mounting Process
Jong-Chan Park, Chung-Lyul Ahn, Tae-Keun Lee
2026-12-01 · DOI: 10.1115/1.4071751Assessment of Thermal Fatigue Reliability in 3D Integrated Through-Silicon Via and Solder Joint Structures Under Oil-Immersion Cooling
Unique Rahangdale, Sonkolon Barua, Rohit Kumar Suthar, Megha Tangri et al.
2026-12-01 · DOI: 10.1115/1.4071873System-Level Thermal Analysis of Two-Phase Direct-to-Chip Cooling for Data Centers With Chilled Facility Water
Qingyang Wang, Serdar Ozguc, Richard W. Bonner
2026-12-01 · DOI: 10.1115/1.4072065Topology Optimization of Backside Films to Mitigate Semiconductor Wafer Warpage
Won Hong Choi, Gil-Eon Jeong
2026-06-01 · DOI: 10.1115/1.4071548Multi-Illumination Feature Enhancement for Robust Ball Grid Array Defect Detection and Explainable Attention Alignment
Nestor A. Zermeño Campos, Julio C. Rodriguez Quiñonez, Adolfo H. Ruelas Puente, Carlos A. Aguilar Avelar et al.
2026-06-01 · DOI: 10.1115/1.4071814Multiphase Modeling and Machine Learning Analysis of Void Formation in Chip-to-Wafer Underfill Encapsulation
Rilwan Kayode Apalowo, Aizat Abas, Muhammad Naqib Nashrudin, Taufik Azahari et al.
2026-06-01 · DOI: 10.1115/1.4071771Server-Level Demonstration of Package-Integrated, Two-Phase Jet Impingement Cooling on Artificial Intelligent Chipsets
Sidharth Rajeev, Ketan Yogi, Venkata Achyuth Kunchapu, Yunchun Yang et al.
2026-06-01 · DOI: 10.1115/1.4072231Flexible Electronic Devices Encapsulation Technology: Materials, Processes, and Applications
Chunru Chen, Zan Lu, Yantao Gao, Chenxin Fang et al.
2026-06-01 · DOI: 10.1115/1.4071329Effect of Bending Deformation on Damage of Ag Nanoparticle Lines Under Electrical Loading
Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
2026-06-01 · DOI: 10.1115/1.4071537Reviews
Community Reviews
Version History
October 4, 2026 at 9:18 pm
October 2, 2026