Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms

ADVERTISEMENT RETURN TO ISSUEPREVReviewNEXTChemical Mechanical Planarization: Slurry Chemistry, Materials, and MechanismsMahadevaiyer Krishnan*†, Jakub W. Nalaskowski†, and Lee M. Cook‡View Author Information IBM T.J. Watson Research Center, Yorktown Heights, New York 10598, and Dow Electronic Materials, Newark, Delaware 19713* To whom correspondence should be addressed. E-mail: [email protected]. Tel/Fax: +1-914-945-3827.†IBM T.J. Watson Research Center.‡Dow Electronic Materials.Cite this: Chem. Rev. 2010, 110, 1, 178–204Publication Date (Web):November 23, 2009Publication History Received30 April 2009Published online23 November 2009Published inissue 13 January 2010https://pubs.acs.org/doi/10.1021/cr900170zhttps://doi.org/10.1021/cr900170zreview-articleACS PublicationsCopyright © 2009 American Chemical SocietyRequest reuse permissionsArticle Views13097Altmetric-Citations361LEARN ABOUT THESE METRICSArticle Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to reflect usage leading up to the last few days.Citations are the number of other articles citing this article, calculated by Crossref and updated daily. Find more information about Crossref citation counts.The Altmetric Attention Score is a quantitative measure of the attention that a research article has received online. Clicking on the donut icon will load a page at altmetric.com with additional details about the score and the social media presence for the given article. Find more information on the Altmetric Attention Score and how the score is calculated. Share Add toView InAdd Full Text with ReferenceAdd Description ExportRISCitationCitation and abstractCitation and referencesMore Options Share onFacebookTwitterWechatLinked InRedditEmail Other access optionsGet e-Alertsclose SUBJECTS:Defects,Deposition,Insulators,Metals,Oxides Get e-Alerts