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SCHOLARLY PUBLICATION

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert Patti

📖 Proceedings of the IEEE → 📅 2006-06-01 🔗 DOI: 10.1109/jproc.2006.873612
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📄 Abstract

Three-dimensional integrated circuits (3-D ICs) offer significant improvements over two-dimensional circuits, and promise a solution to the severe problems that are being, and will be, encountered as monolithic process geometries are reduced to below 65 nm. Several methods associated with the fabrication of 3-D ICs are discussed in this paper, and the techniques developed by Tezzaron Semiconductor Corp., are described in detail. Four successful 3-D ICs are described, along with the anticipated benefits of applying 3-D design to future system-on-chip (SoC) devices.

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